Low melting point solder development
Expect phase compositions, thermal properties by thermodynamics calculation. Produce solders and analysis the microstructure and phase...
top of page
Research
Research Area
Cu to Cu bonding
3D electronic packaging development Thermal compression Cu to Cu bonding by using Cu-Sn reaction Solid - State Diffusion (SSD) bonding...
Development of gas sensors based on metal oxide semiconductors for potential diagnosis of diseases
Air pollution and biomarker gases such as NO2, acetone, toluene, and ethanol. Novel material synthesis via sputter, hydrothermal,...
Metal oxide / Chalcogenide Nano material synthesis& TFT device fabrication by Solution process...
Low temperature solution process has many advantages ; No need vacuum, cost efficiency, mass production, can use flexible substrate....
Intermetallic compouds for next-generation interconnect materials
Due to resistivity and reliability issues, conventional Cu interconnect faces problems. Intermetallic compounds have been studied as...
bottom of page