Expect phase compositions, thermal properties by thermodynamics calculation. Produce solders and analysis the microstructure and phase...

3D electronic packaging development Thermal compression Cu to Cu bonding by using Cu-Sn reaction Solid - State Diffusion (SSD) bonding...

Low temperature solution process has many advantages ; No need vacuum, cost efficiency, mass production, can use flexible substrate....

Due to resistivity and reliability issues, conventional Cu interconnect faces problems. Intermetallic compounds have been studied as...