Cu to Cu bonding

3D electronic packaging development Thermal compression Cu to Cu bonding by using Cu-Sn reaction Solid - State Diffusion (SSD) bonding below melting point of Sn(231.9℃) Analysis the microstructure and phase composition by SEM, EDS and TEM

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Cu-Sn phase diagram

• Thin Sn layer is deposited by e- beam evaporator

• Cu to Cu bonding by using Sn-Sn reaction

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Bonding Process

▲ Thermal compression bonding by heating press

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Analysis by TEM

▲ Analysis the microstructure and phase composition by SEM, EDS and TEM